XERON Showcases Complete PC Hardware Ecosystem at Gamescom 2026, Expands into the European Market

Beijing, China, July 31, 2026 – XERON, a new PC hardware brand driven by its “From Origin, Beyond Boundaries” philosophy of returning to first principles through purposeful design and user-centric innovation, will showcase its complete hardware ecosystem at Gamescom 2026, taking place from August 26 to 30 at Koelnmesse in Cologne, Germany. Following its successful global debut at COMPUTEX 2026, the event marks XERON’s first major exhibition in Europe and a significant milestone as the brand expands its presence across the European market.
At Gamescom 2026, XERON will present its complete ecosystem of PC hardware solutions, including PC cases, power supplies, cooling systems, thermal interface materials, and a range of accessories. The exhibition also marks an important step in the company’s European expansion strategy, providing a platform to build new partnerships with distributors and channel partners interested in introducing XERON’s products to markets across the region.

Visit XERON at Gamescom 2026

Date: August 26–30, 2026
Venue: Koelnmesse, Cologne, Germany
Hall: 03.2
Booth: F-049g
Seeking European Distribution Partners
As part of its expansion into the European market, XERON is actively seeking distributors, retailers, and strategic channel partners across the region. The company welcomes collaboration opportunities with businesses interested in bringing XERON’s expanding portfolio of PC hardware products to local markets and delivering innovative solutions to a wider community of PC enthusiasts and professionals.
Visitors, media representatives, and prospective business partners are invited to visit the XERON booth at Gamescom 2026 to experience the brand’s latest PC hardware innovations firsthand, connect with the XERON team, and explore opportunities for future collaboration and business partnerships.
Featured Products

C-LAB Flagship Enthusiast Chassis

Headlining the showcase is the C-LAB, XERON’s flagship art gallery PC case that reflects the company’s philosophy of blending high-performance engineering with modern industrial design. As a premium showcase chassis, the C-LAB exemplifies XERON’s vision of elevating the personal computer beyond functionality—transforming it into both a powerful computing platform and a striking design centerpiece.

XERON T1000 Flagship AIO Cooler with Cu-Diamond Cold Plates and Liquid Metal Cooling

The T1000 is XERON’s flagship all-in-one liquid cooler, engineered with next-generation cooling technology to meet the thermal demands of today’s high-performance processors. It features two key innovations—a diamond-copper composite cold plate and a dual liquid-loop cooling system—that work together to enhance heat transfer, improve cooling efficiency, and maintain stable CPU temperatures even under intensive workloads.

Diamond-Copper Composite Cold Plate

Instead of the conventional solid copper cold plate found in most AIO liquid coolers, the T1000 utilizes a diamond-copper composite cold plate with approximately 1.5 to 2.5 times the thermal conductivity of standard copper. This advanced material enables faster heat dissipation from the CPU, reducing thermal resistance and delivering CPU temperatures of up to 5°C lower under comparable operating conditions.

Independent Dual Loop Cooling

The XERON T1000 features an innovative independent dual-loop cooling system that integrates a sealed liquid metal loop with a conventional coolant loop. Unlike traditional AIO liquid coolers that rely solely on liquid coolant, the T1000 uses liquid metal to rapidly absorb heat directly from the CPU before transferring it through a copper interface to the primary cooling loop. This dual-loop design enhances heat transfer efficiency, enabling faster thermal dissipation and more consistent cooling performance under demanding workloads.
By distributing concentrated heat across a larger surface area before it reaches the primary coolant loop, the dual-loop design improves overall heat transfer efficiency and allows the radiator to dissipate heat more effectively. The result is more stable CPU temperatures during sudden workload spikes, reduced thermal fluctuations, and quieter operation by minimizing unnecessary fan ramp-up.

Power Supplies

LUX PT Series

The LUX PT Series is XERON’s lineup of fully modular ATX 3.1 power supplies, available in 750W, 850W, 1000W, and 1200W configurations. Certified with 80 PLUS Titanium and PPLP Titanium ratings, the series is built with premium Japanese capacitors, pure copper cables, and a bridge-less APFC circuit paired with LLC and DC-to-DC architecture. Together, these features deliver exceptional power efficiency, stable performance, and long-term reliability for high-end gaming and professional PC systems.

MAX PG Series

Designed for AI workstations and professional-grade systems, the LUX PT WS Series is available in 1650W and 2500W models, each equipped with multiple 12V-2×6 connectors to support demanding multi-GPU configurations. Combining Titanium-level power efficiency with premium-grade components, the series delivers stable, reliable power for AI workloads, content creation, scientific computing, and other high-performance computing applications.

MAX PB Series

The MAX PB Series is XERON’s lineup of mainstream ATX 3.1 power supplies, available in 550W, 650W, 750W, and 850W capacities. Certified 80 PLUS 230V EU Bronze, the series is built with premium Japanese capacitors and a DC-to-DC power design to deliver stable, efficient, and reliable performance. Designed for everyday gaming and productivity systems, the MAX PB Series offers a balance of quality, efficiency, and long-term durability at an accessible price point.

MAX PS Series

Designed for compact, high-performance systems, the MAX PS Series is a lineup of fully modular SFX12V 4.1 and ATX12V 3.1 power supplies, available in 650W, 750W, 850W, and 1000W capacities. Certified with 80 PLUS Gold and PPLP Gold, the series delivers high efficiency, stable power output, and reliable performance in a space-saving form factor, making it an ideal choice for modern small form factor (SFF) gaming and professional PC builds.

MAX PX Series

Expanding XERON’s small form factor power supply lineup, the MAX PX Series offers 80 PLUS Platinum-certified SFX power supplies in 750W, 850W, and 1000W capacities. Built with premium components and a high-efficiency power architecture, the series delivers exceptional power efficiency, stable output, and reliable performance, making it an ideal choice for enthusiast-grade compact gaming and workstation systems.

MAX P3000G WS

The MAX P3000G WS is a 3000W 80 PLUS Gold power supply engineered for AI servers and multi-GPU workstation platforms. Equipped with multiple 12V-2×6 connectors, it is designed to support the latest high-power graphics cards and compute hardware. An advanced power architecture combining APFC, Full-Bridge LLC, and DC-to-DC (D2D) conversion ensures efficient power delivery, excellent voltage stability, and dependable performance for demanding AI and high-performance computing workloads.

Cooling Solutions

LUX L360 VISION

The LUX L360 VISION is an all-in-one liquid cooler that combines premium cooling performance with an immersive visual experience. It features a 6.67-inch curved OLED display protected by AG glass, complemented by an Infinity Mirror Expansion panel that creates the illusion of visuals extending beyond the display. The cooler is equipped with a low-noise pump and 2400RPM dual-curve fans, delivering cooling performance capable of handling processors with up to 320W TDP. To further enhance thermal efficiency, the LUX L360 VISION incorporates an offset mounting bracket that aligns the CPU hotspot with the center of the copper cold plate, reducing CPU temperatures by approximately 2–3°C compared to conventional mounting brackets.

NEX L360 ARGB

The NEX L360 ARGB Series is designed for hassle-free installation, featuring daisy-chain fan connectivity that simplifies cable management for a cleaner, more organized build. It combines a low-noise pump, a Magnetic 3D Lighting Ornament, and annular ARGB fans to deliver efficient cooling alongside vibrant, customizable lighting effects. To further enhance thermal performance, the cooler incorporates an offset mounting bracket that aligns the CPU hotspot with the center of the copper cold plate, reducing CPU temperatures by approximately 2–3°C compared to conventional mounting brackets.

MAX F120 Series

The MAX F120 Series cooling fans are engineered with dual-curve fan blades and advanced turbulence-reduction technology to maximize airflow while maintaining exceptionally low noise levels. A streamlined single-cable design further simplifies installation and cable management, enabling cleaner builds with improved airflow and a more organized interior.

NEX F120A / NEX F120RA Series

Available in both forward and reverse blade configurations, the NEX F120A and NEX F120RA ARGB fans are designed to deliver optimal airflow without compromising aesthetics. Their integrated fan blade design and side hollow cutouts enhance airflow efficiency while showcasing vibrant, customizable ARGB lighting, making them an ideal choice for clean, visually striking PC builds.

Thermal Interface Materials

LUX E71 Liquid Metal Thermal Paste

A high-performance liquid metal thermal interface material engineered for enthusiast-grade systems, delivering exceptional heat transfer with a thermal conductivity rating of 26W/m·K. Designed for users seeking maximum thermal performance, it enables efficient heat dissipation and improved cooling potential for high-performance CPUs and demanding workloads.

MAX E72 Liquid Metal Composite Thermal Grease

The MAX E72 is a liquid metal composite thermal paste that combines the exceptional thermal performance of liquid metal with the convenience, safety, and reliability of traditional thermal compounds. Its embedded liquid metal microstructure helps prevent shifting and leakage while maintaining consistent contact between the CPU and cooler. With effective thermal conductivity exceeding 8W/m·K and low thermal resistance, the MAX E72 delivers efficient heat transfer, enhanced long-term stability, and a more user-friendly application experience compared to pure liquid metal solutions.

NEX E75 & NEX E72 Thermal Grease

The NEX E72 and NEX E75 thermal pastes feature an electrically insulated formula designed for safe and reliable cooling across a wide range of devices. Available in 2g and 5g capacities, these compounds are optimized for mainstream PCs, laptops, and graphics cards. Their soft, easy-to-apply texture creates an ultra-thin interface layer that minimizes thermal resistance and improves heat transfer between the processor and cooler. Designed for everyday cooling needs and system maintenance, the NEX Series delivers consistent long-term thermal performance with effortless application.

See pricing of featured products below:

For more information, please contact your local XERON representative.

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